JED4600S
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JED4600SHigh density Discrete PKG Die Bonder |
| JED4600S is a high quality & high accurate Die Bonder with flexible capability for eutectic or epoxy Die Bonding process. The solution for diodes and transistors in sub-1-mm2 footpronts, similar to those of 0402-sized passive components. | |
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- Key Features
- Options
- Links
| - High accuracy (X, Y = ± 35μm, θ = ± 3 °) |
- Best solution for HB LED manufacturing by eutectic / epoxy co-use system |
| - Suitable for CSP (High Density Matrix pkg ) with ultra-high-speed (0.25 seconds) |
| - Vacuum Clamp |
| - Back side recognition Camera |
| - “Low impact” plate spring bond head |
| - Rotary Bond head for theta control |
| - Post bond inspection and wafer mapping for better yield |
| - SECS/GEM |
| - Strip Map |
| - Gripper Index for Epoxy Process |
Contact us |
Tel: +65-6749 6200 E-MAIL:
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| Spare Parts |
TEL: +65-6749 6200 E-MAIL: |
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