In.D Scope
BGA, SMT, PCB Inspection
and Measurement System
Welding Electrodes
and Soldering Tips
Bonding Tools
Die Bonders
Wire Bonders
Bond Testers
Work Holders
X-Ray Inspection System
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Flexia BGA Inspection System, ESD-Protected
A New, highly Flexible, Video Microscope with side viewing BGA zoom lens (4x zoom factor)
and brilliant Image Quality for flexible Visual Inspection and Digital Image Recording
of BGA, µBGA, CSP and Flip-Chip packages and all other type of components on printed circuit boards.
Flexia BGA creates sharp pictures of solder balls under BGA packages up to 12mm deep (15-20 rows)
and down to 0.05mm component stand off.
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Applications:
- BGA, µBGA, CSP and Flip-Chip solder joints
- Printed solder paste on PCBs (3-dimensional)
- Assembled PCBs and components
- Stencil apertures, solders and flux mixtures
- Pads, cuts and scores
- Connectors, cables and stripped wires
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Sample Images Taken
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