IVI Vision Inspection
CT X-Ray
In.D Scope
BGA, SMT, PCB Inspection
and Measurement System
Welding Electrodes
and Soldering Tips
Bonding Tools
Die Bonders
New Line-Up
DBD5000
EBD6000
FCD4000
Die Bonders
DBD3550SW
DBD4200R
DBD4600S
EBD1800V2
EBD4000S
Laser Chip Bonders
GD200
Wire Bonders
Bond Testers
Work Holders
X-Ray Inspection System
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Full Automatic Eutectic Die Bonder : Model DBD 4200R
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Super High Speed Die Bonder : ( 0.15/chip ), Windows NT Control
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Actual production speed : ( 0.15sec/cycle )
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MTBA = 4 hours ensures minimum down time
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Communication function by Windows NT 4.0 is suitable for remote monitoring / control
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User friendly touch screen operation through GUI
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Option :
- Rotary bond head ( ±90° )
- Wafer mapping
- SECS I / II, GEM
- Epoxy Dispenser
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