IVI Vision Inspection
CT X-Ray
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BGA, SMT, PCB Inspection
and Measurement System
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and Soldering Tips
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DBD5000
EBD6000
FCD4000
Die Bonders
DBD3550SW
DBD4200R
DBD4600S
EBD1800V2
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GD200
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X-Ray Inspection System
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Full Automatic Eutectic Die Bonder : Model DBD 4600S
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Super High Speed ( 0.25sec/chip ) and High Accuracy ( X, Y = ±35µm, θ = ±3° )
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Actual production speed : 0.25sec/cycle
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Matrix lead frame high-speed recognition unit with precision ball screw and AC servo motor
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MTBA = 4 hours ensures minimum down time
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Communication function by Windows NT 4.0 is suitable for remote monitoring / control
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User friendly touch screen operation through GUI
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Applicable for strip type reel type lead frame
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Wafer mapping
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Option :
- Snap cure oven ( for in-line system )
- SECS I / II, GEM
- Chip backside recognition system
- Epoxy Dispenser
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