Product Catalogue :
Die Bonders
IVI Vision Inspection
CT X-Ray
In.D Scope
BGA, SMT, PCB Inspection
and Measurement System
Welding Electrodes
and Soldering Tips
Bonding Tools
Die Bonders
New Line-Up
DBD5000
EBD6000
FCD4000
Die Bonders
DBD3550SW
DBD4200R
DBD4600S
EBD1800V2
EBD4000S
Laser Chip Bonders
GD200
Wire Bonders
Bond Testers
Work Holders
X-Ray Inspection System
Full Automatic IC Die Bonder : Model EBD 6000
Most Compact Size Machine in Semiconductor Industry for 12inch Wafer
Space saving with totally new concept
High accuracy bonding
Capable for stake-die application ( High bonding weight, tape supply )
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13 Kaki Bukit Road 1 #01-05 Eunos Technolink Singapore 415928
Tel: 65-6749 6200 Fax: 65-6742 2237
and Measurement System
