Product Catalogue :
Die Bonders
IVI Vision Inspection
CT X-Ray
In.D Scope
BGA, SMT, PCB Inspection
and Measurement System
Welding Electrodes
and Soldering Tips
Bonding Tools
Die Bonders
New Line-Up
DBD5000
EBD6000
FCD4000
Die Bonders
DBD3550SW
DBD4200R
DBD4600S
EBD1800V2
EBD4000S
Laser Chip Bonders
GD200
Wire Bonders
Bond Testers
Work Holders
X-Ray Inspection System
Full Automatic Flip Chip Die Bonder : Model FCD 4000
Capable from Small to Large Bump Packages
High speed ultrasonic bonding method
Variable bonding weight control system
Space saving
Top
best viewed with IE 6.0 at 1024 by 768 resolution with Flash plug-in
copyright © Component Technology Pte Ltd
13 Kaki Bukit Road 1 #01-05 Eunos Technolink Singapore 415928
Tel: 65-6749 6200 Fax: 65-6742 2237
and Measurement System
