IVI Vision Inspection
CT X-Ray
In.D Scope
BGA, SMT, PCB Inspection
and Measurement System
Welding Electrodes and
Soldering Tips
Bonding Tools
Die Bonders
Wire Bonders
3600
3700
7200
Model 360C
Model 360C-H
Model 360C-HD
Model 360S
Model 20
Bond Testers
Work Holders
X-Ray Inspection System
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Semiconductor Large Wire Bonder : Model 20
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Bonds 100-500 micron (4-20 mil) wire, 3 and 25 mil options available
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Uniform, high yield bonding
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Automatic looping and step back
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Deep access, multiple stitch, and manual Z options
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Phase-locked generator maintains power frequency and eliminates manual re-tuning
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Transducer demand control produces perfect bonds regardless of minor bond site differences
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Ribbon bonding option
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Spotlight targeting available
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Can be operated in semiautomatic or manual mode
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