Bonds to almost any electronic package requiring 100-500 micron (4-20 mil) wire

Four-axis head allows bonding in any direction, to any type of module, lead frame or hybrid substrate

Programmable bonding parameters for each bond produce better bond quality and reliability

Small footprint and removable work platform for easy handler integration

Enhanced process control features can be individually modified for each bond

Orthodyne proprietary gray-scale pattern recognition system gives higher yield and throughput rates

Low maintenance bond head with no pivot bearing or solenoids to bind or wear

Enhanced diagnostics, statistics and wire handling features for better process control

Shaft encoders on all four motion axes for a completely closed-loop positioning system

Sophisticated, menu driven software is easy to program and modify

Options include: side mount monitors, status lights, additional discrete I/O lines, and casters