Bonds to almost any electronic package requiring 100-500 micron (4-20 mil) wire

Four-axis head allows bonding in any direction, to any type of module, lead frame or hybrid substrate

Programmable bonding parameters for each bond produce better bond quality and reliability

Programmable indexing and simplified tooling for fast, simple and repeatable production changeovers

Enhanced process control features can be individually modified for each bond

Orthodyne proprietary gray-scale pattern recognition system gives higher yield and throughput rates

Low maintenance bond head with no pivot bearing or solenoids to bind or wear

Enhanced diagnostics, statistics and wire handling features for better process control

Sophisticated, menu driven software is easy to program and modify

Options include non-destructive pull testing with exclusive built-in loop height detector, and destructive pull test mode