Bonds to almost any electronic package requiring 38-75 micron (1.5-3 mil) wire

Four-axis head allows bonding in any direction, to any type of module, lead frame or hybrid substrate

Programmable bonding parameters for each bond produce better bond quality and reliability

Available as a stand-alone machine, as part of a large and small dual head bonder, or as a retrofit to an existing 360C large wire bonder

Unique low maintenance bond head provides soft touchdown combined with high resolution LVDT for controlled bond placement

Motorized dereeler assembly and jewel bearing wire feed mean better looping control, low maintenance, and high uptime

Programmable lift-off angle and wire feed minimize heel cracks

Modular and flexible design makes for easy integration into automated lines and easy changeover between small and large wire