UPH: The low-mass bond head and X Y table design, in conjunction with high performance drives and advanced motion control technology, result in 20% to 50% higher UPH than previous Orthodyne models

Single- and Multi-Head Configurations: The 7200 platform design provides maximum flexibility. Single- and Multi-head versions let you configure your production line with exactly the number of bond heads required to balance the production flow

High Speed Indexer: The newly designed 7200 Indexer is considered one of the fastest in the market, offering index times of 150ms for a TO220 device

New Small & Large Wire Bond heads: Low-maintenance and low mass bond head design allows for higher UPH and better process control

Programmable Indexer: Lets user store and recall parameters and indexer positions, minimizing programming and calibration for increased uptime

Enhanced PR System: The 7200 features fluorescent area lighting, new wide-angle coaxial light, and improved optics. The enhanced Orthodyne GSIIA PR system ensures accuracy and repeatability

Pullout Clamp Station: Allows the user to have a second set of tooling readily available for quick product changeover and minimized downtime

Process Monitoring: On-board diagnostics and expanded process statistics allow for simplified machine and process monitoring, resulting in high uptime and a high level of quality control

Improved Active Loop Control ( ALC ) Bond head: New ALC bond head design with improved clearance provides better loop control and non-destructive bond head pull test capability for virtually any device

Pull testers: Up to 4 in-line pull testers per bonder module provide expanded non-destructive pull test and loop height check capability for standard and matrix lead  frames

Matrix Capabilities: The 7200 features full matrix capabilities for lead frames up to 72mm wide

Large-Small Wire Configurable: Both bonder modules can be easily configured to either large or small wire, providing maximum flexibility for a changing product spectrum

Networking: Simple networking via Ethernet, USB or serial port. SECS / GEM is available as an option

Software: New GUI-based software structure offers simplified, user-friendly machine operation and sophisticated troubleshooting tools resulting in lower training cost and increased uptime

File Handling: A CDRW, hard drive, and networking capabilities provide easy-to-use tools for data transfer, data storage, and program back-up

Transport Pull testers: The 7200 can be equipped with up to four in-line pull testers per bonder module

Additional Small or Large Wire Kits: These kits provide full configuration flexibility and simple conversion from large to small wire

Additional clamp stations: Pre-setup for simple product changeover, additional clamp stations represent a powerful option to minimize machine downtime

SECS / GEM Interface: Optional factory automation protocol