Product Catalogue : X-Ray Inspection System

 

IVI - Vision Inspection


CT X-Ray


In.D Scope


BGA, SMT, PCB Inspection
and Measurement System



Welding Electrodes
and Soldering Tips



Bonding Tools


Die Bonders


Wire Bonders


Bond Testers


Work Holders


X-Ray Inspection System
    Verifier HR (FXS-090) - Advanced X-Ray Inspection System

 

FSX-090

 

The Verifier HR is an affordable high-resolution and high-magnification x-ray system designed for fast intuitive operation.

The Verifier HRs' small 32 x 34" footprint design, ease-of-use and high-quality imaging makes it ideally suited for failure analysis and rework verification of PCBs up to 16 x 18" | 406 x 457mm.
  • 90kV, 5 micron microfocus no-maintenance x-ray source, provides more than enough power to penetrate challenging packages such as: Ceramic Column Grid Arrays, BGA with metal lids or heat sinks and devices with RF shielding
  • High-resolution 2/4 Image Intensifier with zoom lens and CCD camera provides superb image quality with ultra clear resolution and contrast
  • Small footprint of 32x34" | 813x864mm easily rolled to where ever needed (i.e., production floor, prototype lab, rework area, etc)
  • Greater than >650X magnification provides excellent viewing of internal semiconductor connections such as: wire-bonds, die-attach, delamination, voiding and solder joint opens
  • Systems are CE certified and exceed all safety and radiation protection requirements set forth by CDRH and FDA regulations
  • Semiconductor Applications: Semiconductor prototyping, failure analysis and manufacturing process validation
  • Counterfeit Device Screening Applications: Non-distructive inspection to identify, classify, and report traceability of original electronic components from potential counterfeit parts
 
 

Sample Handling:

Oblique angle viewing up to 30°
  • The standard sample manipulator has five angled set points, to provide angulations up to 30° or more depending on board size
  • Angular viewing provides improved detection of opens, non-wetting and void position

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