Component Technology will be participating in the upcoming Semicon China @ Shanghai New International Expo Centre from 17-19 March. Our booth is located at Hall N2 under Singapore Pavilion with booth number 2733.
We are featuring one of our latest automated vision inspection machines for wire & die bond inspection. Our friendly team lead by JH Li will be more than happy to see you and answer any queries you may have!
Please click HERE for Semicon China 2021 floor plan. Alternatively, you may contact our team at +86 1382 1130 150 or email@example.com
Our colleagues, Ma Haifu (left) and Xue Hongwei are ready to answers any queries you may have!